Meiding Large Format LDI Direct Imaging Exposure Machine

Giant Panel” Compatibility — Industry-Rare Large-Format Exposure Capability

Designed for large panels, with a class-leading 630mm × 1300mm exposure area.

Covers sizes from 300mm to 1.3m in one machine, supporting 0.5–5.0mm thickness.

Ideal for server backplanes, large optoelectronic boards, automotive long PCBs, and industrial panels — no splicing required, ensuring higher accuracy and efficiency.

High-Power Lens Matrix — Uniformity & Depth of Focus Guaranteed

Equipped with 6 laser lenses, total power 300W.

Deep 405nm penetration meets high-sensitivity dry film needs.

Energy uniformity ≥95%, eliminating edge underexposure and hotspots, ensuring consistent board quality.

Lower defect rates and higher yield, ideal for high-energy dry film and solder mask processes.

Maximum Productivity — Dual-Table Parallel Operation, 30%+ Output Increase

High-Speed Exposure: Up to 7.5 panels/min at 80mJ.

Seamless Flow: Dual-table parallel switching minimizes loading/unloading downtime.

Precision Scaling Compensation — Solves Large-Panel Deformation

Supports four scaling modes: Free, Fixed, Measured, and Zoned — with Zoned Scaling as the highlight. It precisely compensates local deformation, combined with 4-/multi-point alignment and self-exposure target accuracy of ±15μm [3σ], minimizing large-panel scrap.